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STM32F103CBU6 数据表(PDF) 39 Page - STMicroelectronics

部件名 STM32F103CBU6
功能描述  Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces
PDF  105 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F103CBU6 数据表(HTML) 39 Page - STMicroelectronics

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STM32F103x8, STM32F103xB
Electrical characteristics
104
5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 10. Operating conditions at power-up / power-down
VIN
I/O input voltage
Standard IO
–0.3
VDD+
0.3
V
FT IO(3)
2 V < VDD  3.6 V –0.3
5.5
VDD = 2 V
–0.3
5.2
BOOT0
0
5.5
PD
Power dissipation at TA =
85 °C for suffix 6 or TA =
105 °C for suffix 7(4)
LFBGA100
454
mW
LQFP100
434
UFBGA100
339
TFBGA64
308
LQFP64
444
LQFP48
363
UFQFPN48
624
VFQFPN36
1000
TA
Ambient temperature for 6
suffix version
Maximum power dissipation
–40
85
°C
Low power dissipation(5)
–40
105
Ambient temperature for 7
suffix version
Maximum power dissipation
–40
105
Low power dissipation(5)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
7 suffix version
–40
125
1. When the ADC is used, refer to Table 46: ADC characteristics.
2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.
4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 93).
5. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 93).
Table 9. General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
µs/V
VDD fall time rate
20



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