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STM32F217VG 数据表(PDF) 150 Page - STMicroelectronics |
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STM32F217VG 数据表(HTML) 150 Page - STMicroelectronics |
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150 / 173 page ![]() Package characteristics STM32F21xxx 150/173 Doc ID 17050 Rev 8 Figure 81. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline 1. Drawing is not to scale. Seating plane C A2 A4 A3 C ddd A1 A e F F e R A0E7_ME_V2 A 15 1 BOTTOM VIEW Ball A1 D E Ball A1 TOP VIEW Table 88. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.002 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 0.130 0.0051 A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.230 0.280 0.330 0.0091 0.0110 0.0130 D 9.950 10.000 10.050 0.3740 0.3937 0.3957 E 9.950 10.000 10.050 0.3740 0.3937 0.3957 e 0.600 0.650 0.700 0.0236 0.0256 0.0276 F 0.400 0.450 0.500 0.0157 0.0177 0.0197 ddd 0.080 0.0031 eee 0.150 0.0059 fff 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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