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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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STM32F217VG 数据表(PDF) 148 Page - STMicroelectronics |
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STM32F217VG 数据表(HTML) 148 Page - STMicroelectronics |
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148 / 173 page  Package characteristics STM32F21xxx 148/173 Doc ID 17050 Rev 8 Figure 79. LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm, package outline 1. Drawing is not to scale. ccc C Seating plane C AA2 A1 c 0.25 mm gauge plane HD D A1 L L1 k 89 88 EHE 45 44 e 1 176 Pin 1 identification b 133 132 1T_ME ZD ZE Table 87. LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 1.600 0.0630 A1 0.050 0.150 0.0020 0.0059 A2 1.350 1.450 0.0531 0.0571 b 0.170 0.270 0.0067 0.0106 c 0.090 0.200 0.0035 0.0079 D 23.900 24.100 0.9409 0.9488 E 23.900 24.100 0.9409 0.9488 e 0.500 0.0197 HD 25.900 26.100 1.0197 1.0276 HE 25.900 26.100 1.0197 1.0276 L(2) 0.450 0.750 0.0177 0.0295 L1 1.000 0.0394 ZD 1.250 0.0492 ZE 1.250 0.0492 k0° 7° 0° 7° ccc 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. L dimension is measured at gauge plane at 0.25 mm above the seating plane. |
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