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STM32F217VG 数据表(PDF) 168 Page - STMicroelectronics |
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STM32F217VG 数据表(HTML) 168 Page - STMicroelectronics |
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168 / 173 page ![]() Revision history STM32F21xxx 168/173 Doc ID 17050 Rev 8 20-Dec-2011 6 Updated SDIO register addresses in Figure 13: Memory map. Updated Figure 3: Compatible board design between STM32F10xx and STM32F2xx for LQFP144 package, Figure 2: Compatible board design between STM32F10xx and STM32F2xx for LQFP100 package, Figure 1: Compatible board design between STM32F10xx and STM32F2xx for LQFP64 package, and added Figure 4: Compatible board design between STM32F10xx and STM32F2xx for LQFP176 package. Updated Section 2.2.3: Memory protection unit. Updated Section 2.2.6: Embedded SRAM. Updated Section 2.2.28: Universal serial bus on-the-go full-speed (OTG_FS) to remove external FS OTG PHY support. In Table 5: STM32F21x pin and ball definitions: changed SPI2_MCK and SPI3_MCK to I2S2_MCK and I2S3_MCK, respectively. Added ETH _RMII_TX_EN alternate function to PG11. Added EVENTOUT in the list of alternate functions for I/O pin/balls. Removed OTG_FS_SDA, OTG_FS_SCL and OTG_FS_INTN alternate functions. In Table 7: Alternate function mapping: changed I2S3_SCK to I2S3_MCK for PC7/AF6, added FSMC_NCE3 for PG9, FSMC_NE3 for PG10, and FSMC_NCE2 for PD7. Removed OTG_FS_SDA, OTG_FS_SCL and OTG_FS_INTN alternate functions. Updated peripherals corresponding to AF12. Removed CEXT and ESR from Table 11: General operating conditions. Added maximum power consumption at TA=25 °C in Table 20: Typical and maximum current consumptions in Stop mode. Added CRYPTO, RNG, and HASH consumption in Table 23: Peripheral current consumption. Updated md minimum value in Table 33: SSCG parameters constraint. Added examples in Section 5.3.11: PLL spread spectrum clock generation (SSCG) characteristics. Updated Table 51: SPI characteristics and Table 52: I2S characteristics. Updated Figure 44: ULPI timing diagram and Table 58: ULPI timing. Updated Table 60: Dynamics characteristics: Ethernet MAC signals for SMI, Table 61: Dynamics characteristics: Ethernet MAC signals for RMII, and Table 62: Dynamics characteristics: Ethernet MAC signals for MII. Updated maximum fS values in Table 63: ADC characteristics. Section 5.3.25: FSMC characteristics: updated Table 69 toTable 80, changed CL value to 30 pF, and modified FSMC configuration for asynchronous timings and waveforms. Updated Figure 58: Synchronous multiplexed PSRAM write timings. UpdatedTable 81: DCMI characteristics. Updated Table 88: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data. Table 92. Document revision history (continued) Date Revision Changes |
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