 |
数据搜索系统，热门电子元器件搜索 |
|
|
数据搜索系统，热门电子元器件搜索 |
|
AS8515 数据表(PDF) 7 Page - ams AG |
|
|
|||||||||||||||||||||||||||||
AS8515 数据表(HTML) 7 Page - ams AG |
|
|
7 / 65 page  www.ams.com Revision 0.7 7 - 65 AS8515 Datasheet - Absolute Maximum Rat i ngs 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 8 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Symbol Parameter Min Typ Max Units Comments Electrical Parameters VSUP Supply voltages -0.3 42 V VSENSE Battery voltage inputs -27 42 V AVDD, DVDD DC supply voltage -0.3 5 V EN Enable input -0.3 42 V VCC Regulated output supplies -0.3 5 V VCC generated by Top die must not be larger than 5V on board level as it has to be connected with Bottom die AVDD and AVCC LIN LIN bus -27 40 V Analog & digital inputs and outputs -0.3 5 V Input current (latch-up immunity) -100 100 mA Norm: AEC-Q100-004 Electrostatic Discharge ESD Electrostatic discharge Norm: AEC-Q100-002 ±6 kV LIN, VSS ±4 kV VSUP, VSENSE ±2 kV All other pins Continuous Power Dissipation Ptot 1 1. Total power dissipation cannot exceed 0.375W to avoid increase in junction temperature, i.e. greater than 130ºC. VCC LDO can supply current externally, which is not greater than 17mA at 18V VSUP and 20mA at 16V VSUP. Total operating power dissipation (all supplies and outputs) 0.375 W MLF-32 in still air, soldered on JEDEC standard board @125º ambient, static operation = no time limit Temperature Ranges and Storage Conditions RΘ Package thermal resistance 34 40 ºC/W Tstg Storage temperature -55 150 ºC TJ Junction temperature 130 ºC TBODY Package body temperature 260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). Humidity non-condensing 5 85 % MSL Moisture Sensitive Level 3 Represents a maximum floor time of 168h |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
