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TLE7232GS 数据表(PDF) 30 Page - Infineon Technologies AG |
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TLE7232GS 数据表(HTML) 30 Page - Infineon Technologies AG |
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30 / 32 page ![]() GPS01214 1) Does not include plastic or metal protrusion of 0.15 max. per side 112 24 13 2) Does not include dambar protrusion of 0.13 max. 3) JEDEC registration MO-137 variation AE 8.65±0.1 0.65 0.25 2) M C 0.17 B 24x ±0.05 A A Index Marking B 0.1 B Seating Plane ±0.1 3.9 1) 0.35 x 45˚ 8˚ MAX. ±0.25 0.64 ±0.2 C 6 M 0.2 8˚ MAX. 0˚...8˚ C 0˚...8˚ 1) SPI Driver for Enhanced Relay Control SPIDER - TLE7232GS Package Outlines Data Sheet 30 Rev. 1.0, 2007-12-18 7 Package Outlines Figure 17 PG-SSOP-24-6 (Plastic Green Shrink Small Outline Package) Green Product (RoHS compliant) For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). |
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