TLE7232GS datasheet(10/32 Pages) INFINEON

10 / 32 page

Pos.

Parameter

Symbol

SPI Driver for Enhanced Relay Control

SPIDER - TLE7232GS

General Product Characteristics

Data Sheet

Rev. 1.0, 2007-12-18

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

4.2

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

ESD Susceptibility

4.1.16

ESD capability of all pins versus GND

ESD

-2

HBM5)

1) Not subject to production test, specified by design.

DD + 0.3 V < 5.5 V

3) Details on configuration of protective function OLCR.OVL can be found in Section 5.2.5

4) Pulse shape represents inductive switch off:

D(t) = ID(0) × (1 - t / tpulse); 0 < t < tpulse

5) ESD susceptibility, HBM according to EIA/JESD 22-A114B

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.2.17

Junction to Solder Point

thJSP

–

K/W

pin 1, 2, 11, 121)

1) Specified

thJSP value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient temperature).

a = 25 °C. LS0 to LS7 are dissipating 1 W power (0.125 W each).

4.2.18

Junction to Ambient

(1s0p+600mm2 Cu)

thJA

–64

–K/W

1)2)

2) Specified

thJA value is according to Jedec JESD51-2,-3 at natural convection on FR4 1s0p board; The product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper area of 600mm2

and 70

µm thickness. T

a = 25 °C, LS0 to LS7 are dissipating 1 W power (0.125 W each).

4.2.19

Junction to Ambient (2s2p)

thJA

–55

–K/W

1)3)

3) Specified

thJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70

µm Cu, 2 x 35 µm Cu).

a = 25 °C, LS0 to LS7 are dissipating 1 W power (0.125 W each).

Absolute Maximum Ratings (cont’d)1)

j = -40 °C to 150 °C; VDD = 4.5 V to 5.5 V; all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

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