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MAT02 数据表(PDF) 3 Page - Analog Devices |
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MAT02 数据表(HTML) 3 Page - Analog Devices |
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3 / 12 page ![]() ELECTRICAL CHARACTERISTICS MAT02E MAT02F Parameter Symbol Conditions Min Typ Max Min Typ Max Unit Offset Voltage VOS VCB = 0 70 220 µV 1 µA ≤ I C ≤ 1 mA1 Average Offset Voltage Drift TCVOS 10 µA ≤ IC ≤ 1 mA, 0 ≤ VCB ≤ VMAX2 0.08 0.3 0.08 1 µV/°C VOS Trimmed to Zero 3 0.03 0.1 0.03 0.3 Input Offset Current IOS IC = 10 µA8 13 nA Input Offset Current Drift TCIOS IC = 10 µA4 40 90 40 150 pA/ °C Input Bias Current IB IC = 10 µA45 50 nA Current Gain hFE IC = 1 mA 5 325 300 IC = 100 µA 275 250 IC = 10 µA 225 200 IC = 1 µA 200 150 Collector-Base ICBO VCB = VMAX 23 nA Leakage Current Collector-Emitter ICES VCE = VMAX, VBE = 0 3 4 nA Leakage Current Collector-Collector ICC VCC = VMAX 34 nA Leakage Current NOTES 1Measured at I C = 10 µA and guaranteed by design over the specified range of IC. 2Guaranteed by V OS test (TCVOS ≅ V T OS for VOS VBE) T = 298K for TA = 25 °C. 3The initial zero offset voltage is established by adjusting the ratio of I C1 to IC2 at TA = 25 °C. This ratio must be held to 0.003% over the entire temperature range. Measurements are taken at the temperature extremes and 25 °C. 4Guaranteed by design. 5Current gain is guaranteed with Collector-Base Voltage (V CB) swept from 0 V to VMAX at the indicated collector current. Specifications subject to change without notice. (VCB = 15 V, –25 C ≤ TA ≤ +85 C, unless otherwise noted.) MAT02 –3– REV. E WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the MAT02 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1 Collector-Base Voltage (BVCBO) . . . . . . . . . . . . . . . . . . . . 40 V Collector-Emitter Voltage (BVCEO) . . . . . . . . . . . . . . . . . . 40 V Collector-Collector Voltage (BVCC) . . . . . . . . . . . . . . . . . . 40 V Emitter-Emitter Voltage (BVEE) . . . . . . . . . . . . . . . . . . . . 40 V Collector Current (IC) . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Emitter Current (IE) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Total Power Dissipation Case Temperature ≤ 40°C2 . . . . . . . . . . . . . . . . . . . . . 1.8 W Ambient Temperature ≤ 70°C3 . . . . . . . . . . . . . . . . 500 mW Operating Temperature Range MAT02E, F . . . . . . . . . . . . . . . . . . . . . . . . . –25 °C to +85°C ORDERING GUIDE VOS max Temperature Package Model (TA = 25 C) Range Option MAT02EH 50 µV –25 °C to +85°C TO-78 MAT02FH 150 µV –25 °C to +85°C TO-78 Operating Junction Temperature . . . . . . . . . . –55 °C to +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300 °C Junction Temperature . . . . . . . . . . . . . . . . . . –65 °C to +150°C NOTES 1Absolute maximum ratings apply to both DICE and packaged devices. 2Rating applies to applications using heat sinking to control case temperature. Derate linearly at 16.4 mW/ °C for case temperature above 40°C. 3Rating applies to applications not using a heat sinking; devices in free air only. Derate linearly at 6.3 mW/ °C for ambient temperature above 70°C. |
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