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AN3232 数据表(PDF) 13 Page - STMicroelectronics

部件名 AN3232
功能描述  Mounting recommendations
PDF  26 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

AN3232 数据表(HTML) 13 Page - STMicroelectronics

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AN3232
Seating plane
Doc ID 17594 Rev 3
13/26
7
Seating plane
The seating plane refers to the plane determined by the bottom surface of the leads after the
package has been mounted. For design purposes, it is the distance between the bottom
surface of the package base and the bottom surface of the transistor leads. This important
dimension is specified on package outline drawings, and for through-the-board mounting of
high power packages, it indicates total depth of the pocket into which the transistor is
seated. To determine the depth of this pocket, the total thickness of the PCB, Cu traces,
solder layers, and the depth of any machined channel is considered. Some points to factor
into this calculation are shown in Figure 4.
Figure 4.
Pocket depth consideration (mm)
Care should be taken to factor in the thickness of the TIM, which is equivalent to increasing
the seating plane dimension. Along similar lines, if the PCB is fused to the heatsink by
means of a bonding film, solder layer, etc., the corresponding thickness of this layer should
be factored into the PCB thickness.
The leads of the transistor should launch perpendicular to the package body onto the traces
of the PCB to reduce mechanical stress to the package and solder joints. In some cases, the
PCB fabrication tolerance is such that the leads extend above the plane defined by the top
of the PCB; this situation is best handled with a judicious selection of solder pad preform or
paste thickness, or by a slight downward bending of the transistor leads [no more than 0.01
in (0.25 mm)].
Figure 5.
Lead bending
As with almost all power packages, in no case should the leads be bent higher than the
topside of the PCB, unless specific lead-forming techniques are applied, such as those
shown in Figure 5. Whenever non-coplanarity exists between the bottom of the device leads
and the top surface of the PCB, assembly mechanical stresses and cyclic life stresses
should be considered. Both lead-forming and a PCB pullback, such as that shown in



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