August 2011

Doc ID 17594 Rev 3

1/26

AN3232

Application note

Mounting recommendations

Introduction

RF power transistors are amongst the highest power density devices in the semiconductor

industry. It is crucial to the reliability and performance of such devices to consider

mechanical stress and thermal and electrical resistance within the application environment.

The general purpose of this application note is to provide guidelines for mounting various

by soldering. Specific attention is paid to the STAC244B and STAC265B boltdown styles and

the STAC244F and STAC265F flangeless styles, which are used to encapsulate numerous

VDMOS and LDMOS technology products.

This application note is intended to provide mounting tips and design guidelines. For actual

data please refer to the relevant product datasheet.

STAC is a registered trademarks of STMicroelectronics.

Figure 1.

STAC boltdown packages

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