AN3232

Package attachment to thermal base by means of soldering

Doc ID 17594 Rev 3

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heating zones may be required to optimize for uniform temperatures at the interface of the

STAC package and copper core layer.

Regardless of the amplifier assembly and choice of soldering method, the industry standard

reflow profile recommended in J-STD-020D for solder reflow operations is acceptable for

STAC packages. It is important that this profile, as shown in Figure 10, is respected at the

component level. According to table 4-2 of the JEDEC reference, a max Tp of 245 °C is

advised, but STAC packages can survive many reflows at temperatures up to a body

temperature of 265 °C with no damage. However, such excursions up to this extreme

temperature are not recommended because many other board level components may not

survive such stressful conditions.

Figure 10.

Component level temperature profile

Note:

max, tp = Table 5.

Table 5.

1.

Tolerance: the device manufacturer/supplier assures process compatibility up to and including the stated

classification temperature (this means peak reflow temperature + 0 °C. For example 260 °C + 0 °C) at the

rated MSL level.

Package thickness

< 1.6 mm

260 + 0 °C

260 + 0 °C

260 + 0 °C

1.6 mm - 2.5 mm

250 + 0 °C

245 + 0 °C

> 2.5 mm

250 + 0 °C

245 + 0 °C