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MPC8264AVR 数据表(PDF) 43 Page - Motorola, Inc |
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MPC8264AVR 数据表(HTML) 43 Page - Motorola, Inc |
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43 / 48 page ![]() MOTOROLA MPC826xA (HiP4) Family Hardware Specifications 43 Package Description 1.5 Package Description The following sections provide the package parameters and mechanical dimensions for the MPC826xA. 1.5.1 Package Parameters Package parameters are provided in Table 21. The package type is a 37.5 x 37.5 mm, 480-lead TBGA. Table 21. Package Parameters Parameter Value Package Outline 37.5 x 37.5 mm Interconnects 480 (29 x 29 ball array) Pitch 1.27 mm Nominal unmounted package height 1.55 mm |
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