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MPC8264AVR 数据表(PDF) 30 Page - Motorola, Inc |
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MPC8264AVR 数据表(HTML) 30 Page - Motorola, Inc |
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30 / 48 page ![]() 30 MPC826xA (HiP4) Family Hardware Specifications MOTOROLA Pinout Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view. Figure 14. Side View of the TBGA Package 1 2 3 4 5 6 7 8 91011 121314 1516 17 18 19 20 21 22 23 24 25 26 27 28 29 Not to Scale 1 2 3 4 5 6 7 8 9 10 11 12 13 1415 16171819 202122 23 24 252627 28 29 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ Soldermask Copper Traces Die Copper Heat Spreader (Oxidized for Insulation) 1.27 mm Pitch Glob-Top Dam Etched Pressure Sensitive Die Glob-Top Filled Area Polymide Tape Cavity Adhesive Attach View |
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