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LAN8710AI 数据表(PDF) 66 Page - Microchip Technology

部件名 LAN8710AI
功能描述  Small Footprint MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX
PDF  82 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

LAN8710AI 数据表(HTML) 66 Page - Microchip Technology

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Small Footprint MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX and flexPWR® Technology
Datasheet
Revision 1.4 (08-23-12)
66
SMSC LAN8710A/LAN8710Ai
DATASHEET
Chapter 5 Operational Characteristics
5.1
Absolute Maximum Ratings*
Supply Voltage (VDDIO, VDD1A, VDD2A) (Note 5.1) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +3.6V
Digital Core Supply Voltage (VDDCR) (Note 5.1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +1.5V
Ethernet Magnetics Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +3.6V
Positive voltage on signal pins, with respect to ground (Note 5.2) . . . . . . . . . . . . . . . . . . . . . . . . . . +6V
Negative voltage on signal pins, with respect to ground (Note 5.3) . . . . . . . . . . . . . . . . . . . . . . . . -0.5V
Positive voltage on XTAL1/CLKIN, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.6V
Positive voltage on XTAL2, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.5V
Ambient Operating Temperature in Still Air (TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Note 5.40
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55oC to +150oC
Junction to Ambient (
θ
JA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..48.3C/W
Junction to Case (
θ
JC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10.6
oC/W
Lead Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to JEDEC Spec. J-STD-020
HBM ESD Performance per JEDEC JESD22-A114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 3A
IEC61000-4-2 Contact Discharge ESD Performance (Note 5.5) . . . . . . . . . . . . . . . . . . . . . . . . . .+/-8kV
IEC61000-4-2 Air-Gap Discharge ESD Performance (Note 5.5) . . . . . . . . . . . . . . . . . . . . . . . . .+/-15kV
Latch-up Performance per EIA/JESD 78 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+/-150mA
Note 5.1
When powering this device from laboratory or system power supplies, it is important that
the absolute maximum ratings not be exceeded or device failure can result. Some power
supplies exhibit voltage spikes on their outputs when AC power is switched on or off. In
addition, voltage transients on the AC power line may appear on the DC output. If this
possibility exists, it is suggested that a clamp circuit be used.
Note 5.2
This rating does not apply to the following pins: XTAL1/CLKIN, XTAL2, RBIAS.
Note 5.3
This rating does not apply to the following pins: RBIAS.
Note 5.4
0oC to +85oC for extended commercial version, -40oC to +85oC for industrial version.
Note 5.5
Performed by independent 3rd party test facility.
*Stresses exceeding those listed in this section could cause permanent damage to the device. This is
a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Functional operation of the device at any condition exceeding those indicated in
Section 5.2, "Operating Conditions**", Section 5.1, "Absolute Maximum Ratings*", or any other
applicable section of this specification is not implied. Note, device signals are NOT 5 volt tolerant
unless specified otherwise.



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