M35B32 datasheet(43/44 Pages) STMICROELECTRONICS

43 / 44 page

DocID18391 Rev 4

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M35B32

Revision history

Table 16. Document revision history

Date

Version

Changes

15-Mar-2011

Initial release.

04-Apr-2011

Updated:

– Section : Typical application

– Note b on page 6

24-May-2011

Status of document changed from Internal to Public.

27-May-2015

Updated:

– Features;

– Disclaimer: Removed military warning;

– Section 11: Package mechanical data;

– Figure 22: SO8N – 8-lead plastic small outline, 150 mils body width,

package outline;

– Figure 24: TSSOP8 – 8-lead thin shrink small outline, 3 x 4.4 mm,

0.5 mm pitch, package outline

– Figure 25: UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile

fine pitch dual flat package outline

– Table 12: SO8N – 8-lead plastic small outline, 150 mils body width,

package mechanical data

– Table 13: TSSOP8 – 8-lead thin shrink small outline, 3 x 4.4 mm,

0.5 mm pitch, package mechanical data

– Table 14: UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile

fine pitch dual flat package mechanical data

Added:

– Figure 23: SO8N – 8-lead plastic small outline, 150 mils body width,

package recommended footprint.

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