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STM32F479AI 数据表(PDF) 189 Page - STMicroelectronics |
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STM32F479AI 数据表(HTML) 189 Page - STMicroelectronics |
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189 / 208 page  DocID028010 Rev 2 189/208 STM32F479xx Package information 206 Table 114. WLCSP168 - 168-pin, 4.891 x 5.692 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.170 - - 0.0067 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating. - 0.025 - - 0.0010 - b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 4.856 4.891 4.926 0.1912 0.1926 0.1939 E 5.657 5.692 5.727 0.2227 0.2241 0.2255 e - 0.400 - - 0.0157 - e1 - 4.400 - - 0.1732 - e2 - 5.200 - - 0.2047 - F - 0.2455 - - 0.0097 - G - 0.246 - - 0.0097 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 |
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