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VD5377 数据表(PDF) 11 Page - STMicroelectronics |
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VD5377 数据表(HTML) 11 Page - STMicroelectronics |
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11 / 88 page ![]() Doc ID 022952 Rev 2 11/88 VD5377 Silicon specification 2.4 Device pinout Figure 2 shows the bond pad layout and Table 6 provides the bond pad coordinates. All dimensions are in microns. Figure 2. VD5377 bond pad layout I2C_SEL0 I2C_SEL1 I2C_SEL2 LED_OUT DVSS BACKLED0 BACKLED1 BACKLED2 DVDD GPIO0 MOTION TEST_CLK SDA (0,19) (19,19) (0,0) (19,0) 2 1 3 4 5 6 7 8 9 19 20 22 23 24 SCL NOT TO SCALE Imaging Array Array Centre Die Centre(0,0) 608 µm 608 µm 10 DVSS 11 18 17 16 14 13 AVSS 25 26 AVDD DVSS 21 12 15 1st pixel (-83, +447) First pixel indicates start of readout for image streaming. |
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