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EXAMPLE STENCIL DESIGN

16X (1.5)

16X (0.45)

(2.48)

(3.4)

BASED ON

0.125 THICK

STENCIL

(5.8)

14X (0.65)

(R0.05) TYP

PowerPAD

TSSOP - 1.2 mm max height

PWP0016D

PLASTIC SMALL OUTLINE

4223219/A 08/2016

2.1 X 2.87

0.175

2.26 X 3.1

0.15

2.48 X 3.4 (SHOWN)

0.125

2.77 X 3.8

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

SYMM

SYMM

1

8

9

16

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES