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STM32L475VC 数据表(PDF) 146 Page - STMicroelectronics |
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STM32L475VC 数据表(HTML) 146 Page - STMicroelectronics |
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146 / 193 page  Electrical characteristics STM32L475xx 146/193 DocID027692 Rev 2 Figure 22. ADC accuracy characteristics Figure 23. Typical connection diagram using the ADC 1. Refer to Table 64: ADC characteristics for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 59: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 59: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 10: Power supply scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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