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P83C266BDR 数据表(PDF) 85 Page - NXP Semiconductors |
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P83C266BDR 数据表(HTML) 85 Page - NXP Semiconductors |
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85 / 92 page ![]() 1999 Mar 10 85 Philips Semiconductors Product specification Microcontrollers for PAL/SECAM TV with OSD and VST P8xCx66 family 23 PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. SOT188-2 44 60 68 1 9 10 26 43 27 61 detail X (A ) 3 bp w M A1 A A4 L p b1 β k1 k X y e E B D H E H v M B D Z D A Z E e v M A pin 1 index 112E10 MO-047AC 0 5 10 mm scale 92-11-17 95-03-11 PLCC68: plastic leaded chip carrier; 68 leads SOT188-2 UNIT A A min. max. max. max. max. 1 A4 bp E (1) (1) (1) eHE Z y w v β mm 4.57 4.19 0.51 3.30 0.53 0.33 0.021 0.013 1.27 0.51 2.16 45 o 0.18 0.10 0.18 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) D(1) 24.33 24.13 HD 25.27 25.02 E Z 2.16 D b1 0.81 0.66 k 1.22 1.07 k 1 0.180 0.165 0.020 0.13 A3 0.25 0.01 0.05 0.020 0.085 0.007 0.004 0.007 Lp 1.44 1.02 0.057 0.040 0.958 0.950 24.33 24.13 0.958 0.950 0.995 0.985 25.27 25.02 0.995 0.985 eE eD 23.62 22.61 0.930 0.890 23.62 22.61 0.930 0.890 0.085 0.032 0.026 0.048 0.042 E e inches D e |
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