ADP5090

Data Sheet

Rev. C | Page 4 of 21

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, MPPT, CBP, MINOP

−0.3 V to +3.6 V

DIS_SW, TERM, SETPG, SETSD, PGOOD, REF to

AGND

−0.3 V to +6.0 V

SW, SYS, BAT, BACK_UP to PGND

−2.0 V to +6.0 V

PGND to GND

−0.3 V to +0.3 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 3.

Package Type

Unit

16-Lead LFCSP

53.1

4.55

°C/W

ESD CAUTION