Data Sheet

ADP5090

Rev. C | Page 21 of 21

OUTLINE DIMENSIONS

Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-33)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Package Description

Package

Option

Branding

ADP5090ACPZ-1-R7

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 100 mA Current Limit

CP-16-33

LPN

ADP5090ACPZ-2-R7

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 195 mA Current Limit

CP-16-33

LT3

ADP5090-1-EVALZ

Evaluation Board

ADP5090-2-EVALZ

Evaluation Board with Solar Harvester

1

Z = RoHS Compliant Part.

3.10

3.00 SQ

2.90

0.30

0.25

0.18

1.80

1.70 SQ

1.60

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

PIN 1

INDICATOR

(0.30)

*0.45

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.203 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

*COMPLIANT TO JEDEC STANDARDS MO-220-WEED-4

WITH EXCEPTION TO LEAD LENGHT.

EXPOSED

PAD

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registered trademarks are the property of their respective owners.

D12263-0-12/15(C)