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FT260Q-R 数据表(PDF) 51 Page - Future Technology Devices International Ltd. |
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FT260Q-R 数据表(HTML) 51 Page - Future Technology Devices International Ltd. |
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51 / 61 page ![]() Copyright © Future Technology Devices International Limited 51 FT260 HID-CLASS USB TO UART/I2C BRIDGE IC Version 1.1 Document No.: FT_001272 Clearance No.: FTDI#484 10 Package Parameters The FT260 is available in WQFN-28 and TSSOP-28 package. The solder reflow profile for WQFN-28 and TSSOP-28 is described in Section 10.5. 10.1 WQFN-28 Package Mechanical Dimensions Figure 10.1 WQFN-28 Package Dimensions The FT260Q is supplied in a RoHS2.0 compliant leadless WQFN-28 package. The package is lead (Pb) free, and uses a ‘green’ compound. The package is fully compliant with European Union REACH 2006/121/EC. This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.5mm pitch. The above mechanical drawing shows the WQFN-28 package. All dimensions are in millimetres. The centre pad on the base of the FT260Q is internally connected to GND and the PCB should not have signal tracking on the top layer under this area. Connect to GND. |
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