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STGAP1S 数据表(PDF) 65 Page - STMicroelectronics |
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STGAP1S 数据表(HTML) 65 Page - STMicroelectronics |
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65 / 67 page ![]() DocID027190 Rev 3 65/67 STGAP1S Package information 67 Figure 26. SO24W suggested land pattern Table 58. SO24W package mechanical data Symbol Dimensions (mm) Notes Min. Typ. Max. A2.35 2.65 A1 0.10 0.30 B0.33 0.51 C0.23 0.32 D 15.20 15.60 (1) 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. E7.40 7.60 e1.27 H 10.00 10.65 h0.25 0.75 L0.40 1.27 K 0 8 Degrees ddd 0.10 |
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