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TNETV2685FIBZUT7 数据表(PDF) 59 Page - Texas Instruments |
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TNETV2685FIBZUT7 数据表(HTML) 59 Page - Texas Instruments |
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59 / 191 page ![]() TMS320DM647 TMS320DM648 www.ti.com SPRS372H – MAY 2007 – REVISED APRIL 2012 6.2 Recommended Clock and Control Signal Transition Behavior All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic manner. 6.3 Power Supplies For more information regarding TI's power management products and suggested devices to power TI DSPs, visit www.ti.com/dsppower. 6.3.1 Power-Supply Sequencing The device includes 1.2-V core supply (CVDD, CVDDESS, CVDD1, AVDDA, DVDDD, AVDDT), and two I/O supplies—3.3-V (DVDD33) and 1.8-V (DVDD18, AVDLL1, AVDLL2, AVDDR). To ensure proper device operation, a specific power-up sequence must be followed. Some TI power-supply devices include features that facilitate power sequencing — for example, Auto-Track and Slow-Start/Enable features. For more information on TI power supplies and their features, visit www.ti.com/dsppower. Following is a summary of the power sequencing requirements: • The power ramp order must be 3.3-V (DVDD33) before 1.8-V (DVDD18, AVDLL1, AVDLL2, AVDDR), and 1.8- V (DVDD18, AVDLL1, AVDLL2, AVDDR) before 1.2-V core supply (CVDD, CVDDESS, CVDD1, AVDDA, DVDDD, AVDDT) —meaning during power up, the voltage at the 1.8-V rail should never exceed the voltage at the 3.3-V rail. Similarly, the voltage at the 1.2-V rail should never exceed the voltage at the DVDDR2 rail. • From the time that power ramp begins, all power supplies (3.3 V, 1.8 V, 1.2 V) must be stable within 200 ms. The term "stable" means reaching the recommended operating condition (see Section 5.2). 6.3.2 Power-Supply Design Considerations Core and I/O supply voltage regulators should be located close to the DSP to minimize inductance and resistance in the power delivery path. Additionally, when designing for high-performance applications utilizing the device, the PC board should include separate power planes for core, I/O, and ground; all bypassed with high-quality low-ESL/ESR capacitors. 6.3.3 Power-Supply Decoupling In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling capacitors; therefore physically smaller capacitors should be used while maintaining the largest available capacitance value. Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order of 100 μF) should be furthest away, but still as close as possible. Large caps for each supply should be placed outside of the BGA footprint. 6.3.4 Power and Sleep Controller (PSC) The power and sleep controller (PSC) controls power by turning off unused power domains or by gating off clocks to individual peripherals/modules. The device uses the clock-gating feature of the PSC only for power savings. The PSC consists of a global PSC (GPSC) and a set of local PSCs (LPSCs). The GPSC contains memory mapped registers, PSC interrupt control, and a state machine for each peripheral/module. An LPSC is associated with each peripheral/module and provides clock and reset control. The LPSCs are shown in Table 6-2. The PSC register memory map is given in Table 6-3. For more details on the PSC, see the TMS320DM647/TMS320DM648 DSP Subsystem Reference Guide (literature number SPRUEU6). Copyright © 2007–2012, Texas Instruments Incorporated Peripheral Information and Electrical Specifications 59 Submit Documentation Feedback Product Folder Link(s): TMS320DM647 TMS320DM648 |
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