STM32F401CD datasheet(119/135 Pages) STMICROELECTRONICS

部件名	STM32F401CD

功能描述	Clock, reset and supply management

PDF	135 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

119 / 135 page

DocID025644 Rev 3

119/135

STM32F401xD STM32F401xE

Package characteristics

133

7.1.2

UFQFPN48, 7 x 7 mm, 0.5 mm pitch package

Figure 49. UFQFPN48, 7 x 7 mm, 0.5 mm pitch, package outline

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

Table 81. UFQFPN48, 7 x 7 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

0.500

0.550

0.600

0.0197

0.0217

0.0236

0.000

0.020

0.050

0.0000

0.0008

0.0020

6.900

7.000

7.100

0.2717

0.2756

0.2795

6.900

7.000

7.100

0.2717

0.2756

0.2795

5.500

5.600

5.700

0.2165

0.2205

0.2244

5.500

5.600

5.700

0.2165

0.2205

0.2244

0.300

0.400

0.500

0.0118

0.0157

0.0197

STM32F401CD 数据表(PDF) 119 Page - STMicroelectronics

STM32F401CD 数据表(HTML) 119 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载