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STM32F401CD 数据表(PDF) 131 Page - STMicroelectronics

部件名 STM32F401CD
功能描述  Clock, reset and supply management
PDF  135 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F401CD 数据表(HTML) 131 Page - STMicroelectronics

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STM32F401xD STM32F401xE
Package characteristics
133
7.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 14: General operating conditions on page 60.
The maximum chip-junction temperature, TJ max., in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
•
TA max is the maximum ambient temperature in °C,
•ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
7.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 85. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
UFQFPN48
32
°C/W
Thermal resistance junction-ambient
WLCSP49
51
Thermal resistance junction-ambient
LQFP64
50
Thermal resistance junction-ambient
LQFP100
42
Thermal resistance junction-ambient
UFBGA100
56



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