STM32F769AI datasheet(10/255 Pages) STMICROELECTRONICS

10 / 255 page

List of tables

STM32F765xx STM32F767xx STM32F768Ax STM32F769xx

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DocID029041 Rev 4

Table 128. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238

Table 129. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242

Table 130. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules

(0.4 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

Table 131. UFBGA176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245

Table 132. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . . . 246

Table 133. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248

Table 134. TFBGA216 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 249

Table 135. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251

Table 136. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252

Table 137. Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . 253

Table 138. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254

STM32F769AI 数据表(PDF) 10 Page - STMicroelectronics