STM32F769AI datasheet(13/255 Pages) STMICROELECTRONICS

13 / 255 page

DocID029041 Rev 4

13/255

STM32F765xx STM32F767xx STM32F768Ax STM32F769xx

List of figures

Figure 92.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 237

Figure 93.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239

Figure 94.

LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240

Figure 95.

WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241

Figure 96.

WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

Figure 97.

WLCSP180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244

Figure 98.

UFBGA176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245

Figure 99.

UFBGA176+25, 10 x 10 mm x 0.65 mm, ultra fine-pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246

Figure 100. UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

Figure 101. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248

Figure 102. TFBGA216, 13 x 13 mm, 0.8 mm pitch, thin fine-pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249

Figure 103. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250

STM32F769AI 数据表(PDF) 13 Page - STMicroelectronics

STM32F769AI 数据表(HTML) 13 Page - STMicroelectronics

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