CCG2 datasheet(27/33 Pages) CYPRESS

27 / 33 page

EZ-PD™ CCG2 Datasheet

Document Number: 001-93912 Rev. *L

Page 27 of 33

Packaging

Figure 15. 20-ball WLCSP (1.63 ×

 2.03 × 0.55 mm) FN20B Package Outline, 001-95010

Table 28. Package Characteristics

Parameter

Description

Conditions

Min

Typ

Max

Units

Operating ambient temperature

Industrial

–40

°C

Extended Industrial

105

°C

Operating junction temperature

Industrial

–40

–

100

°C

Extended Industrial

125

°C

TJA

Package

JA (20-ball WLCSP)

–

°C/W

TJC

Package

JC (20-ball WLCSP)

–

0.7

–

°C/W

TJA

Package

JA (14-pin DFN)

–

°C/W

TJC

Package

JC (14-pin DFN)

–

°C/W

TJA

Package

JA (24-pin QFN)

–

°C/W

TJC

Package

JC (24-pin QFN)

–

°C/W

Table 29. Solder Reflow Peak Temperature

Package

Maximum Peak Temperature

Maximum Time within 5 °C of Peak Temperature

20-ball WLCSP

260 °C

30 seconds

14-pin DFN

260 °C

30 seconds

24-pin QFN

260 °C

30 seconds

Table 30. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2

Package

MSL

20-ball WLCSP

MSL 1

14-pin DFN

MSL 3

24-pin QFN

MSL 3

TOP VIEW

BOTTOM VIEW

SIDE VIEW

NOTES:

1. REFERENCE JEDEC PUBLICATION 95, DESIGN GUIDE 4.18

2. ALL DIMENSIONS ARE IN MILLIMETERS

001-95010 *A

CCG2 数据表(PDF) 27 Page - Cypress Semiconductor

CCG2 数据表(HTML) 27 Page - Cypress Semiconductor

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

数据表下载

链接网址

CCG2 数据表(PDF) 27 Page - Cypress Semiconductor

CCG2 数据表(HTML) 27 Page - Cypress Semiconductor

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

数据表 下载

链接网址

数据表下载