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DS3153N 数据表(PDF) 60 Page - Dallas Semiconductor |
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DS3153N 数据表(HTML) 60 Page - Dallas Semiconductor |
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60 / 60 page ![]() DS3151/DS3152/DS3153/DS3154 Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Ma xi m Integr at ed Pr oducts, 120 San Gabr i el Dr ive, Sunnyval e, CA 94086 40 8- 737- 7600 © 2003 Maxim Integrated Products · Printed USA 60 of 60 16. THERMAL INFORMATION Table 16-A. Thermal Properties, Natural Convection PARAMETER MIN TYP MAX UNITS Ambient Temperature (Note 1) -40 +85 °C Junction Temperature -40 +125 °C Theta-JA ( qJA), Still Air (Note 2) 22.4 °C/W Psi-JB 9.2 °C/W Psi-JT 1.6 °C/W Note 1: The package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power. Note 2: Theta-JA ( qJA) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power. Table 16-B. Theta-JA ( qJA) vs. Airflow FORCED AIR (m/s) THETA-JA ( qJA) 0 22.4 °C/W 1 19.0 °C/W 2.5 17.2 °C/W 17. REVISION HISTORY REVISION DESCRIPTION 012103 DS3154 new product release 040403 DS3151/DS3152/DS3153 new product releases. Electrical Characteristics section, Notes 1 and 2: Changed 44.73MHz to 51.84MHz; added indication that specs are lower for rev A2; “all ones driven into RXPn/RXNn (1.0V square wave)” changed to “analog loopback enabled” to match production test methodology. Table 13-B, Input leakage, IIL: -10 mA min changed to -50mA min. Table 13-B: Replaced TBD values for IDD, IDDTS, and IDDPD (DS3151/DS3152/DS3153); changed IDDPD spec from 38 typ and 50 max to 45 typ and 70 max. Table 14-A and Table 14-B: Changed pins RBIN, RCINV, TBIN, and TCINV to “N.C.” to reflect they are not available in CPU bus mode. 072303 Figure 1-1: Labeled capacitors connected to transformer center taps as “(optional)”. Section 6, Optional Pre-Amp Paragraph: Clarified that the pre-amp contributes +14dB of flat gain. Table 11-A: Changed leakage inductance to 0.150 mH max. Table 11-B: Reformatted table and added row for Pulse Engineering’s T3049 octal transformer. Table 13-H: Reworded Note 20. 120303 GCR Register Definition (page 16): Clarified that RST bit holds the digital logic of the LIU in reset rather than the whole LIU. Table 13-B: Changed DS3151 IDD from 130mA (max) to 100mA (max). Changed DS3151 IDDTTS from 105mA (max) to 80mA (max). Removed sentences in Notes 1 and 2 that labeled IDD and IDDTTS specs for rev A1 devices. |
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