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DS3153N 数据表(PDF) 60 Page - Dallas Semiconductor

部件名 DS3153N
功能描述  Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs
PDF  60 Pages
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制造商  DALLAS [Dallas Semiconductor]
网页  https://www.maximintegrated.com/en.html
标志 DALLAS - Dallas Semiconductor

DS3153N 数据表(HTML) 60 Page - Dallas Semiconductor

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DS3151/DS3152/DS3153/DS3154 Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Ma xi m Integr at ed Pr oducts, 120 San Gabr i el Dr ive, Sunnyval e, CA 94086 40 8- 737- 7600
© 2003 Maxim Integrated Products
· Printed USA
60 of 60
16.
THERMAL INFORMATION
Table 16-A. Thermal Properties, Natural Convection
PARAMETER
MIN
TYP
MAX
UNITS
Ambient Temperature (Note 1)
-40
+85
°C
Junction Temperature
-40
+125
°C
Theta-JA (
qJA), Still Air (Note 2)
22.4
°C/W
Psi-JB
9.2
°C/W
Psi-JT
1.6
°C/W
Note 1: The package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power.
Note 2: Theta-JA (
qJA) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test board
with no airflow and dissipating maximum power.
Table 16-B. Theta-JA (
qJA) vs. Airflow
FORCED AIR (m/s)
THETA-JA (
qJA)
0
22.4
°C/W
1
19.0
°C/W
2.5
17.2
°C/W
17.
REVISION HISTORY
REVISION
DESCRIPTION
012103
DS3154 new product release
040403
DS3151/DS3152/DS3153 new product releases.
Electrical Characteristics section, Notes 1 and 2: Changed 44.73MHz to 51.84MHz; added indication that
specs are lower for rev A2; “all ones driven into RXPn/RXNn (1.0V square wave)” changed to “analog
loopback enabled” to match production test methodology.
Table 13-B, Input leakage, IIL: -10
mA min changed to -50mA min.
Table 13-B: Replaced TBD values for IDD, IDDTS, and IDDPD (DS3151/DS3152/DS3153); changed IDDPD
spec from 38 typ and 50 max to 45 typ and 70 max.
Table 14-A and Table 14-B: Changed pins RBIN, RCINV, TBIN, and TCINV to “N.C.” to reflect they are
not available in CPU bus mode.
072303
Figure 1-1: Labeled capacitors connected to transformer center taps as “(optional)”.
Section 6, Optional Pre-Amp Paragraph: Clarified that the pre-amp contributes +14dB of flat gain.
Table 11-A: Changed leakage inductance to 0.150
mH max.
Table 11-B: Reformatted table and added row for Pulse Engineering’s T3049 octal transformer.
Table 13-H: Reworded Note 20.
120303
GCR Register Definition (page 16): Clarified that RST bit holds the digital logic of the LIU in reset rather
than the whole LIU.
Table 13-B: Changed DS3151 IDD from 130mA (max) to 100mA (max). Changed DS3151 IDDTTS from
105mA (max) to 80mA (max). Removed sentences in Notes 1 and 2 that labeled IDD and IDDTTS specs for
rev A1 devices.



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