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S29AS016J 数据表(PDF) 7 Page - Cypress Semiconductor |
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S29AS016J 数据表(HTML) 7 Page - Cypress Semiconductor |
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7 / 59 page ![]() Document Number: 002-01122 Rev.*L Page 7 of 59 S29AS016J 3.3 FBGA Connection Diagram, 6.0 mm x 4.0 mm (VDF048) 3.4 Special Handling Instructions Special handling is required for Flash Memory products in BGA packages. Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. C BJ K E DFH A L A6 A4 A9 A11 NC A17 WE# NC RESET# A2 5 3 2 1 6 4 A7 A3 A10 A13 WP# RY/BY# A1 A14 A18 A5 A8 A12 A0 A15 DQ10 DQ8 DQ4 DQ11 CE# A16 DQ9 OE# DQ5 DQ6 A19 NC VSS DQ7 DQ1 DQ0 DQ14 DQ15 DQ3 DQ2 DQ12 VCC DQ13 VSS G Fine-pitch Ball Grid Array - VDF048 |
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