SSM2517

Data Sheet

Rev. B | Page 16 of 16

OUTLINE DIMENSIONS

1.490

1.460 SQ

1.430

0.350

0.320

0.290

0.655

0.600

0.545

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

3

B

C

0.270

0.240

0.210

0.385

0.360

0.335

SEATING

PLANE

0.50

BALL PITCH

BALL A1

IDENTIFIER

Figure 31. 9-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-9-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM2517CBZ-R7

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-2

SSM2517CBZ-RL

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-2

EVAL-SSM2517Z

Evaluation Board

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registered trademarks are the property of their respective owners.

D09211-0-9/11(B)