DA6512.003

2 December, 2016

4 (32)

ELECTRICAL CHARACTERISTICS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Internal regulator voltage

VREG

Temp mode regulator enabled

Note 1.

1.75

1.8

1.85

V

Standby current

All inputs at VDD, no load

Note 2

0.01

0.3

A

Conversion current

consumption

During conversion

Cap. Dif. Reg OFF

Cap. Ratio Reg OFF

Temp Reg ON

VDD Mon. Reg OFF

Note 3

580

510

455

455

850

750

700

700

A

Average current

consumption

1 conversion/s,

Cap. Dif. Reg OFF

OSR=2048

OSR=1024

OSR=512

OSR=256

Note 4

24.1

12.2

6.3

3.3

35.4

18.0

9.2

4.9

A

VDD rise time for proper

power on reset (POR)

Note 5

1

ms

Internal system clock

oscillator frequency

Internal system clock

oscillator frequency

Normal clock (SOSC=00)

Division by 2 (SOSC=01)

Division by 4 (SOSC=10)

Division by 8 (SOSC=11)

TEMPREGEN=0, Note 6

180

200

100

50

25

210

kHz

Normal clock (SOSC=00)

TEMPREGEN=1, Note 6

160

180

200

kHz

Sensor excitation

frequency

MCLK

Normal clock (SOSC=00)

Division by 2 (SOSC=01)

Division by 4 (SOSC=10)

Division by 8 (SOSC=11)

TEMPREGEN=0

45

50

25

12.5

6.25

52.5

kHz

Capacitance and VDD

monitoring conversion

time

Normal clock (SOSC=00)

OSR=2048

OSR=1024

OSR=512

OSR=256

TEMPREGEN=0

41.6

21.1

10.9

5.8

46.2

23.5

12.1

6.4

ms

Temperature conversion

Time

Normal clock (SOSC=00)

OSR=2048

OSR=1024

OSR=512

OSR=256

TEMPREGEN=1

46.2

23.5

12.1

6.4

52.0

26.4

13.6

7.2

ms

Note 1. Internal regulator must to be enabled only in temperature mode and should be disabled in capacitance and VDD monitoring modes.

Note 2. Leakage current may increase if digital input voltages are not close to VDD (logic level high) or GND (logic level low). Also setting

XCS low activates the EEPROM memory regardless of the XSPI setting and the device consumes 20

A …30A current. To minimize

current consumption XCS should be set low only during time periods when the device is used during SPI communication.

Note 4. Average current consumption in other measurement modes can be calculated by scaling these current consumption values with

Note 5. It is also recommended to reset the device manually either by XCLR pin or using reset register after every power up (VDD rise). In

case the VDD rise time is longer than specified here the device has to be kept in a reset during power up by the XCLR pin (XCLR=low).

Violating this may risk EEPROM memory integrity. See APPLICATION INFORMATION for examples of external POR circuits.