GD25S512MDFJS datasheet(23/87 Pages) GIGADEVICE

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3.3V Uniform Sector

Dual and Quad Serial Flash

GD25S512MD

7.1.

Software Die Select (C2H)

Each stacked die has a pre-

assigned “Die ID#” by the factory, in the sequence of 0x00, 0x01, etc. At any given time,

there can only be one Active Die within the GD25S package, to communicate with the external SPI controller. After power-

up, Die #0 is always the Active Die. Software Die Select (C2H) instruction is used to select a specific die to be active,

according to the 8-bit Die ID following the C2H instruction as illustrated in Figure 4

“Concurrent Operations” can be realized by assigning the current Active Die to perform a Program/Erase operation

which requires some amount of time to finish. While the internal Program/Erase operation is ongoing, the controller can

issue a “Software Die Select (C2H)” instruction to select another die to be active. Depending on the system requirement, a

Read, Program or Erase operation can be performed on the newly se

lected Active Die. “Read while Program/Erase” or

“Multi-Die Program/Erase” can be performed in such fashion, to improve system Program/Erase throughput and to avoid

constant Program/Erase Suspend and Resume activities in certain applications.

Figure 4 Software Die Select Sequence Diagram

7.2. Read Active Die ID# (F8H)

The Read Active Die ID# command is used to read ID of active die within the MCP package, and each bit being

latched-in on the rising edge of SCLK. Then the active die ID# is shifted out on SO, and each bit being shifted out, at a Max

frequency fR, on the falling edge of SCLK. The Active Die ID# may be read at any time, even while a Program, Erase or

Read cycle is in progress.

Figure 5 Read Active Die ID# Sequence Diagram

Command

C2H

CS#

SCLK

High-Z

9 10 11 12 13 14 15

MSB

Die ID#

MSB

Command

F8H

CS#

SCLK

High-Z

9 10 11 12 13 14 15

MSB

Die ID#

MSB

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