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TDA7786 数据表(PDF) 10 Page - STMicroelectronics |
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TDA7786 数据表(HTML) 10 Page - STMicroelectronics |
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10 / 54 page ![]() Block diagram and pin description TDA7786, TDA7786M 10/54 DocID026122 Rev 5 37 SAI_AUDIO_BCLK In/Out HD Radio™ connectivity/ Audio output I2S interface SAI clk Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 38 SAI_AUDIO_WCLK In/Out Audio SAI word-select Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 39 SAI_AUDIO_DO Out Audio SAI data output Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 40 SAI_AUDIO_DO In Audio SAI data-input Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 41 SAI_BB_BCLK In/Out SAI Base-Band clock Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 42 SA_BB_WCLK In/Out SAI Base-Band word-select Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 43 SAI_BB_I Out SAI Base-Band I data Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 44 SAI_BB_Q Out SAI Base-Band Q data Pull-down 50 kΩ to ground, SINE_3V3_LIN pad 45 BLEND/AS In HD blend input Pull-down 50 kΩ to ground 46 GND1V2 - - DSP core ground - 47 VDD core 1V2 In - DSP core 1.2 V supply - 48 Test In - Test Mode Pull-down 50 kΩ to ground 49 VDDPLL1V2 In - Digital PLL 1.2 V supply - 50 VDDIO1V2 In - Internal inter-IC communication 1.2 V supply - 51 VCC-REF In - Front-end reference frequency and regulator 5 V supply - Table 2. Pin description (continued) Pin Pin name I/O Function Description Equivalent circuit |
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