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TLV9152SIRUGR 数据表(PDF) 36 Page - Texas Instruments |
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TLV9152SIRUGR 数据表(HTML) 36 Page - Texas Instruments |
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36 / 63 page  36 TLV9151, TLV9152, TLV9154 SBOS986B – OCTOBER 2019 – REVISED MAY 2020 www.ti.com Product Folder Links: TLV9151 TLV9152 TLV9154 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated 11.6 Trademarks E2E is a trademark of Texas Instruments. TINA-TI is a trademark of Texas Instruments, Inc and DesignSoft, Inc. Bluetooth is a registered trademark of Bluetooth SIG, Inc. TINA, DesignSoft are trademarks of DesignSoft, Inc. All other trademarks are the property of their respective owners. 11.7 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.8 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. |
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