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USB334X 数据表(PDF) 84 Page - Microchip Technology |
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USB334X 数据表(HTML) 84 Page - Microchip Technology |
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84 / 92 page  USB334x DS00002646A-page 84 2009-2018 Microchip Technology Inc. FIGURE 9-1: 24-Pin Sawn QFN - USB3341 Only (CONTINUED) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 2.60 2.60 MILLIMETERS 0.50 BSC MIN E MAX 3.90 Contact Pad Length (X24) Contact Pad Width (X24) Y1 X1 0.85 0.30 Microchip Technology Drawing C04-2143A MJ NOM 24-Lead Very Thin Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [VQFN] SILK SCREEN 1 2 24 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 3.90 Contact Pad to Center Pad (X24) G1 0.23 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: G2 Contact Pad to Contact Pad (X20) G2 0.20 |
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