0 Hz/DC to 13 GHz, 2.5 kV HBM ESD,

SP4T, MEMS Switch with Integrated Driver

Data Sheet

ADGM1004

Rev. D

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FEATURES

Fully operational down to 0 Hz/dc

On resistance: 2.9 Ω (maximum)

Off leakage: 0.5 nA (maximum)

−3 dB bandwidth

10.8 GHz (typical) for RF1, RF4

13 GHz (typical) for RF2, RF3

RF performance characteristics

Insertion loss: 0.45 dB (typical) at 2.5 GHz

Isolation: 24 dB (typical) at 2.5 GHz

IP3: 67 dBm (typical)

RF input power: 32 dBm (maximum)

Actuation lifetime: 1 billion cycles (minimum)

Hermetically sealed switch contacts

On switching time: 75 μs (maximum)

ESD HBM rating

5 kV for RF1 to RF4 and RFC pins

2.5 kV for all other pins

Integrated driver removes the need for an external driver

Supply voltage: 3.0 V to 3.6 V

CMOS/LVTTL compatible

Parallel and SPI Interface

Independently controllable switches

Switch is in an open state with no power supply present

Requirement to avoid floating nodes on all RFx pins (see the

Floating Node section)

5 mm × 4 mm × 1.45 mm, 24-lead LFCSP

Operating temperature range: 0°C to +85°C

APPLICATIONS

Relay replacements

Automatic test equipment (ATE): RF, digital, and mixed signals

Load and probe boards: RF, digital, and mixed signals

RF test instrumentation

Reconfigurable filters and attenuators

High performance RF switching

GENERAL DESCRIPTION

The ADGM1004 is a wideband, single-pole, four-throw (SP4T)

switch fabricated using Analog Devices, Inc., microelectro-

mechanical system (MEMS) switch technology. This technology

enables a small form factor, wide RF bandwidth, highly linear, low

insertion loss switch that is operational from 0 Hz/dc to 13 GHz,

making it an ideal solution for a wide range of RF and precision

equipment switching needs.

An integrated driver chip generates a high voltage to

electrostatically actuate switch that can be controlled by a parallel

interface and a serial peripheral interface (SPI). All four switches

are independently controllable.

The device is packaged in a 24-lead, 5 mm × 4 mm × 1.45 mm,

lead frame chip-scale package (LFCSP).

To ensure optimum operation of the ADGM1004, follow the

Critical Operational Requirements section exactly.

affected by part to part variation, channel to channel variation,

cycle actuations, settling time post turn on, bias voltage, and

temperature changes.

Note that throughout this data sheet, multifunction pins, such

as IN1/SDI, are referred to either by the entire pin name or by a

single function of the pin, for example, SDI, when only that

function is relevant.