ADGM1004JCPZ-R2 datasheet(9/32 Pages) AD

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Data Sheet

ADGM1004

Rev. D | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to GND

−0.3 V to +6 V

Digital Inputs1

−0.3 V to VDD + 0.3 V or

+30 mA (whichever occurs

first)

DC Voltage Rating2

±7 V

Standoff Voltage3

20 V

RFx to AGND

±10 V

RFC to AGND

±10 V

RFx to RFC

20 V

Current Rating2

250 mA

RF Power Rating4

33 dBm

Temperature

Operating Range

0°C to +85°C

Storage Range

−65°C to +150°C

Reflow Soldering (Pb-Free)

Peak

260 (+0/−5)°C

Time at Peak

10 sec to 30 sec

Electrostatic Discharge (ESD)

Human Body Model (HBM)

RF1 to RF4 and RFC

5 kV

All Other Pins

2.5 kV

Field Induced Charged Device

Model5

All Pins

1.25 kV

Group D

Mechanical Shock (with 0.5 ms

Pulse) 6

1500 g

Vibration (Acceleration at 50 g)

20 Hz to 2000 Hz

Constant Acceleration

30,000 g

1 Clamp overvoltages at INx by internal diodes. Limit the current to the

maximum ratings given.

2 This rating is with respect to the switch in the on position with no radio

frequency signal applied.

3 This rating is with respect to the switch in the off position.

4 This rating is with respect to the switch in the on position and terminated

into 50 Ω. The rating is 27 dBm when the switch is unterminated.

5 A safe automated handling and assembly process is achieved at this rating

level by implementing industry standard ESD controls.

6 If the device is dropped during handling, do not use the device.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Only one absolute maximum rating can be applied at any one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-24-41

°C/W

1 A simulated θJA number is evaluated using the maximum junction

temperature in the package and the total power being dissipated in the

package under operating conditions. For thermal performance calculation

purposes at 25°C, a power dissipation of 113 mW per switch can be used.

This value is calculated from a typical RON of 1.8 Ω and an absolute maximum

current rating of 250 mA.

ESD CAUTION

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