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STW5095 数据表(PDF) 67 Page - STMicroelectronics |
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STW5095 数据表(HTML) 67 Page - STMicroelectronics |
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67 / 69 page ![]() STw5095 18 Package Outline 67/69 18 Package Outline Note: 1 The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized markings, or other feature of package body or integral heatslug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. Dimensions [mm] OUTLINE AND MECHANICAL DATA Ref. Min. Typ. Max. A (1) 1. The total profile height is measured from the seating plane to the top of the component. 1.010 1.200 (2) 2. Max mounted height is 1.12mm.Based on a 0.28mm ball pad diameter. Solder paste is 0.15mm thickness and 0.28mm diameter. A1 0.150 A2 0.820 b 0.250 0.300 0.350 D 4.850 5.000 5.150 D1 3.500 E 4.850 5.000 5.150 E1 3.500 e 0.450 0.500 0.550 f 0.600 0.750 0.900 TFBGA 5x5x1.20 64 F8x8 0.50 Thin Profile Fine Pitch Ball Grid Array ddd 0.080 Figure 32. Package mechanical data ddd C C A1 A A2 ef D1 D H G F E D C B A 12345678 A1 CORNER INDEX AREA Øb (64 BALLS) PLANE SEATING BOTTOM VIEW See Note 1 |
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