USB82642 datasheet(52/64 Pages) MICROCHIP

52 / 64 page

USB82642

DS60001253F-page 52

 2012-2021 Microchip Technology Inc.

FIGURE 10-2:

USB82642AM/AMR 48-PIN VQFN CONTINUED

Note:

Exposed Pad Variation H is valid for the USB82642.

Microchip Technology Drawing C04-223C Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

48-Lead Plastic Quad Flat, No Lead Package (RS) - 7x7 mm Body [VQFN]

With Exposed Pad; Punch Singulated

Number of Terminals

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

(A3)

0.50 BSC

0.20 REF

0.30

0.18

0.80

0.00

0.23

0.40

(See Exposed Pad Variations)

0.85

0.01

7.00 BSC

MILLIMETERS

MIN

NOM

0.50

0.30

0.90

0.05

MAX

0°

12°

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is punch singulated

Dimensioning and tolerancing per ASME Y14.5M

Mold Draft Angle

0.60

0.65

0.70

6.75 BSC

Mold Cap Height

Molded Top Width

Molded Top Length

Terminal-to-Exposed-Pad

0.20

(See Exposed Pad Variations)

7.00 BSC

6.75 BSC

Corner Chamfer

0.24

0.42

0.60

5.40 5.50 5.60

5.20 5.30 5.40

5.00 5.10 5.20

4.00 4.10 4.20

5.40 5.50 5.60

5.20 5.30 5.40

5.00 5.10 5.20

4.00 4.10 4.20

Symbol

Exposed Pad Variations

MIN NOM MAX MIN NOM MAX

Variant

USB82642 数据表(PDF) 52 Page - Microchip Technology

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