USB82642 datasheet(53/64 Pages) MICROCHIP

53 / 64 page

 2012-2021 Microchip Technology Inc.

DS60001253F-page 53

USB82642

FIGURE 10-3:

USB82642AM/AMR 48-PIN VQFN LAND PATTERN

RECOMMENDED LAND PATTERN

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

See Center

MILLIMETERS

0.50 BSC

MIN

MAX

6.90

Contact Pad Length (X48)

Contact Pad Width (X48)

0.85

0.30

Microchip Technology Drawing C04-2223B

NOM

SILK SCREEN

Contact Pad Spacing

6.90

Contact Pad to Center Pad (X48)

G1 0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

ØV

48-Lead Plastic Quad Flat, No Lead Package (RS) - 7x7 mm Body [VQFN]

With Exposed Pad; Punch Singulated

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

Pad Variations

5.60

5.40

5.20

4.20

5.60

5.40

5.20

4.20

Symbol

Center Pad Variations

MIN NOM MAX MIN NOM MAX

Variant

USB82642 数据表(PDF) 53 Page - Microchip Technology

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