MPC8544EBVTARGA datasheet(82/117 Pages) NXP

部件名	MPC8544EBVTARGA

功能描述	MPC8544E PowerQUICC III Integrated Processor Hardware Specifications

PDF	117 Pages

Scroll/Zoom	100%

制造商	NXP [NXP Semiconductors]

网页	http://www.nxp.com

标志

82 / 117 page

MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8

Freescale Semiconductor

Package Description

18.2

Mechanical Dimensions of the MPC8544E FC-PBGA

Figure 59 shows the mechanical dimensions and bottom surface nomenclature of the MPC8544E,

783 FC-PBGA package without a lid.

Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature

of the MPC8544E FC-PBGA without a Lid

Notes:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.

7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.

MPC8544EBVTARGA 数据表(PDF) 82 Page - NXP Semiconductors