PPC5604BAMLL4R datasheet(29/109 Pages) NXP

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Package pinouts and signal descriptions

MPC5604B/C Microcontroller Data Sheet, Rev. 15

NXP Semiconductors

2.7

Nexus 2+ pins

In the 208 MAPBGA package, eight additional debug pins are available (see Table 6).

1 Alternate functions are chosen by setting the values of the PCR.PA bitfields inside the SIUL module.

PCR.PA = 00

→ AF0; PCR.PA = 01 → AF1; PCR.PA = 10 → AF2; PCR.PA = 11 → AF3. This is intended to select

the output functions; to use one of the input functions, the PCR.IBE bit must be written to ‘1’, regardless of the

values selected in the PCR.PA bitfields. For this reason, the value corresponding to an input only function is

reported as “—”.

2 Multiple inputs are routed to all respective modules internally. The input of some modules must be configured by

setting the values of the PSMIO.PADSELx bitfields inside the SIUL module.

3 208 MAPBGA available only as development package for Nexus2+

4 All WKPU pins also support external interrupt capability. See wakeup unit chapter for further details.

5 NMI has higher priority than alternate function. When NMI is selected, the PCR.AF field is ignored.

6 “Not applicable” because these functions are available only while the device is booting. Refer to BAM chapter of the

reference manual for details.

7 Value of PCR.IBE bit must be 0

8 Be aware that this pad is used on the MPC5607B 100-pin and 144-pin to provide VDD_HV_ADC and

VSS_HV_ADC1. Therefore, you should be careful in ensuring compatibility between MPC5604B/C and

MPC5607B.

9 Out of reset all the functional pins except PC[0:1] and PH[9:10] are available to the user as GPIO.

PC[0:1] are available as JTAG pins (TDI and TDO respectively).

PH[9:10] are available as JTAG pins (TCK and TMS respectively).

If the user configures these JTAG pins in GPIO mode the device is no longer compliant with IEEE 1149.1-2001.

10 The TDO pad has been moved into the STANDBY domain in order to allow low-power debug handshaking in

STANDBY mode. However, no pull-resistor is active on the TDO pad while in STANDBY mode. At this time the pad

is configured as an input. When no debugger is connected the TDO pad is floating causing additional current

consumption. To avoid the extra consumption TDO must be connected. An external pull-up resistor in the range of

47–100 k

Ω should be added between the TDO pin and VDD_HV. Only in case the TDO pin is used as application

pin and a pull-up cannot be used then a pull-down resistor with the same value should be used between TDO pin

and GND instead.

11 Available only on MPC560xC versions, MPC5603B 64 LQFP, MPC5604B 64 LQFP and MPC5604B 208 MAPBGA

devices

12 Not available on MPC5602B devices

13 Not available in 100 LQFP package

14 Available only on MPC5604B 208 MAPBGA devices

15 Not available on MPC5603B 144-pin devices

Table 6. Nexus 2+ pin descriptions

Debug pin

Function

I/O

direction

Pad type

Function

after reset

Pin number

100

LQFP

144

LQFP

208 MAP

BGA

MCKO

Message clock out

—

MDO0

Message data out 0

—

H15

MDO1

Message data out 1

—

H16

MDO2

Message data out 2

—

H14

MDO3

Message data out 3

—

H13

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