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PPC5604BAMLL4R 数据表(PDF) 36 Page - NXP Semiconductors |
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PPC5604BAMLL4R 数据表(HTML) 36 Page - NXP Semiconductors |
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36 / 109 page  MPC5604B/C Microcontroller Data Sheet, Rev. 15 Package pinouts and signal descriptions NXP Semiconductors 36 NOTE RAM data retention is guaranteed with VDD_LV not below 1.08 V. 2.14 Thermal characteristics 2.14.1 Package thermal characteristics Table 14. LQFP thermal characteristics1 Symbol C Parameter Conditions2 Pin count Value Unit RθJA CC D Thermal resistance, junction-to-ambient natural convection3 Single-layer board - 1s 64 60 °C/W 100 64 144 64 Four-layer board - 2s2p 64 42 100 51 144 49 RθJB CC D Thermal resistance, junction-to-board4 Single-layer board - 1s 64 24 °C/W 100 36 144 37 Four-layer board - 2s2p 64 24 100 34 144 35 RθJC CC D Thermal resistance, junction-to-case5 Single-layer board - 1s 64 11 °C/W 100 22 144 22 Four-layer board - 2s2p 64 11 100 22 144 22 ΨJB CC D Junction-to-board thermal characterization parameter, natural convection Single-layer board - 1s 64 TBD °C/W 100 33 144 34 Four-layer board - 2s2p 64 TBD 100 34 144 35 |
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