PPC5606BAVLL6R datasheet(47/114 Pages) NXP

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Electrical characteristics

MPC5607B Microcontroller Data Sheet, Rev. 10

NXP Semiconductors

4.6.5

I/O pad current specification

The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a

VDD/VSS supply pair as described in Table 21.

Table 22 provides I/O consumption figures.

In order to ensure device reliability, the average current of the I/O on a single segment should remain below

the IAVGSEG maximum value.

ttr

CC D Output transition time output pin2

MEDIUM configuration

CL = 25 pF

VDD = 5.0 V ± 10%,

PAD3V5V = 0

SIUL.PCRx.SRC = 1

—

TCL = 50 pF

—

DCL = 100 pF

—

DCL = 25 pF

VDD = 3.3 V ± 10%,

PAD3V5V = 1

SIUL.PCRx.SRC = 1

——

TCL = 50 pF

—

DCL = 100 pF

—

ttr

CC D Output transition time output pin2

FAST configuration

CL = 25 pF

VDD = 5.0 V ± 10%,

PAD3V5V = 0

——

CL = 50 pF

—

CL = 100 pF

—

CL = 25 pF

VDD = 3.3 V ± 10%,

PAD3V5V = 1

——

CL = 50 pF

—

CL = 100 pF

—

1 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified

2 C

L includes device and package capacitances (CPKG < 5 pF).

Table 21. I/O supply segments

Package

Supply segment

12345

678

208

MAPBGA1

1 208 MAPBGA available only as development package for Nexus2+

Equivalent to 176 LQFP segment pad distribution

MCKO

MDOn

/MSEO

176 LQFP

pin7 –

pin27

pin28 –

pin57

pin59 –

pin85

pin86 –

pin123

pin124 –

pin150

pin151 –

pin6

—

144 LQFP

pin20 –

pin49

pin51 –

pin99

pin100 –

pin122

pin 123 –

pin19

—

100 LQFP

pin16 –

pin35

pin37 –

pin69

pin70 –

pin83

pin84 –

pin15

—

Table 20. Output pin transition times (continued)

Symbol

Parameter

Conditions1

Value

Unit

Min Typ Max

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