SST26VF032BEUI datasheet(41/76 Pages) MICROCHIP

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DS20006152A-page 41

SST26VF032BEUI

6.0

ELECTRICAL SPECIFICATIONS

6.1

Power-Up Specifications

All functionalities and DC specifications are specified

for a VDD ramp rate of greater than 1V per 100 ms (0V

to 3.0V in less than 300 ms). See Table 6-3 and Figure

6-1 for more information.

When VDD drops from the operating voltage to below

the minimum VDD threshold at power-down, all opera-

tions are disabled and the device does not respond to

commands. Data corruption may result if a power-down

occurs while a Write-Registers, program, or erase

operation is in progress. See Figure 6-2.

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi-

mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func-

tional operation of the device at these conditions or conditions greater than those defined in the operational

sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may

affect device reliability.)

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD+0.5V

Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . .-2.0V to VDD+2.0V

Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

1. Output shorted for no more than one second. No more than one output shorted at a time.

TABLE 6-1:

OPERATING RANGE

Range

Ambient Temp

VDD

Industrial

-40°C to +85°C

2.3-3.6V

TABLE 6-2:

AC CONDITIONS OF TEST1

Input Rise/Fall Time

Output Load

3ns

CL = 30 pF

1. See Figure 8-5.

TABLE 6-3:

RECOMMENDED SYSTEM POWER-UP/DOWN TIMINGS

Symbol

Parameter

Minimum

Max

Units

Condition

TPU-READ1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

VDD Min to Read Operation

100

µs

TPU-WRITE1 VDD Min to Write Operation

100

µs

TPD1

Power-down Duration

100

VOFF

VDD off time

0.3

0V recommended

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