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TDA4AL...ALZQ1 数据表(PDF) 100 Page - Texas Instruments |
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TDA4AL...ALZQ1 数据表(HTML) 100 Page - Texas Instruments |
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100 / 251 page ![]() 7.1 Absolute Maximum Ratings (continued) over operating free-air temperature range (unless otherwise noted) (1) (2) PARAMETER MIN MAX UNIT Latch-up Performance, Class II (125°C)(4) I-Test –100 100 mA Over-Voltage (OV) Test NA 1.5 × VDD(6) V TSTG (5) Storage temperature –55 +150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) All voltage values are with respect to their associated VSS or VSSA_x, unless otherwise noted. (3) This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be –0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp-up and ramp-down sequences. (4) For current pulse injection: Pins stressed per JEDEC JESD78E (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage. For overvoltage performance: Supplies stressed per JEDEC JESD78E (Class II) and passed specified voltage injection. (5) For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning to ambient room temperature before usage. (6) VDD is the voltage on the corresponding power-supply pin(s) for the IO. (7) The VMON pins provides a way to monitor the system power supply. For more information, see System Power Supply Monitor Design Guidelines using VMON/POK. (8) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see USB VBUS Design Guidelines. Fail-safe IO terminals are designed such they do not have dependencies on the respective IO power supply voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO power supplies are turned off. The specific signals that are fail safe are highlighted in the parameter "Steady State Max. Voltage at all fail-safe IO pins". All other IO terminals are not fail-safe and the voltage applied to them should be limited to the value defined by the "Steady State Max. Voltage at all other IO pins" parameter in Absolute Maximum Ratings. T overshoot T undershoot T period Overshoot = 20% of nominal IO supply voltage Undershoot = 20% of nominal IO supply voltage A. Tovershoot + Tundershoot < 20% of Tperiod Figure 7-1. IO Transient Voltage Ranges 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±1000 V Charged-device model (CDM), per AEC Q100-011 All pins ±250 Corner pins (A1, AJ29) ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. TDA4VE-Q1, TDA4AL-Q1, TDA4VL-Q1 SPRSP62 – DECEMBER 2022 www.ti.com 100 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 |
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