数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

TDA4AL...ALZQ1 数据表(PDF) 113 Page - Texas Instruments

部件名 TDA4AL...ALZQ1
功能描述  TDA4VE TDA4AL TDA4VL Jacinto™ Processors, Silicon Revision 1.0
PDF  251 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TDA4AL...ALZQ1 数据表(HTML) 113 Page - Texas Instruments

Back Button TDA4AL...ALZQ1 Datasheet HTML 109Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 110Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 111Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 112Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 113Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 114Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 115Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 116Page - Texas Instruments TDA4AL...ALZQ1 Datasheet HTML 117Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 113 / 251 page
background image
7.8 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Section 7.3, Recommended Operating Conditions.
7.8.1 Thermal Resistance Characteristics for ALZ Package
It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
NO.
PARAMETER
DESCRIPTION
ALZ PACKAGE
°C/W
(1)(3)
AIR FLOW
(m/s)
(2)
T1
RΘJC
Junction-to-case
0.3
N/A
T2
RΘJB
Junction-to-board
2.0
N/A
T3
RΘJA
Junction-to-free air
10.4
0
T4
Junction-to-moving air
6.1
1
T5
5.3
2
T6
4.8
3
T7
ΨJT
Junction-to-package top
0.16
0
T8
0.17
1
T9
0.17
2
T10
0.17
3
T11
ΨJB
Junction-to-board
1.8
0
T12
1.5
1
T13
1.4
2
T14
1.4
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
m/s = meters per second.
(3)
°C/W = degrees Celsius per watt.
www.ti.com
TDA4VE-Q1, TDA4AL-Q1, TDA4VL-Q1
SPRSP62 – DECEMBER 2022
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
113
Product Folder Links: TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com